ETI CAPABILITIES
Double sided Surface Mount Technology (SMT), Through Hole (PTH), or Mixed Technology Assembly
RoHS (Lead-Free) Capable
Quick Turn Prototypes
Circuit Boards up to 18” x 24” and 32 layers
In-Circuit and Functional Testing
Design For Manufacturability (DFM) Assistance
Full or Partial Box Build
Customer Drop Ship
Wire Processing & Wire Harnesses Fabrication
Equipment
Assembleon Pick and Place
- 18000 components per hour
- BGA, µBGA, CSP, odd components
- .012” fine pitch
- 0201 components
- Connectors up to 4” (100mm) long
Spea In-Circuit Tester
- Analog and Digital device testing
- AOI optical inspection
Ekra Automated Stencil Printer
- Up to 29” x 29”
- Vision alignment
- Post print vision inspection
Heller Convection Reflow oven
Vitronics IR Reflow Oven
- Seven thermal zones
- KIC thermal profiling software
OK Industries BGA Rework Station
- BGA, µBGA, CSP, Fine Pitch Rework
- Computer controlled profiling software
- Vision alignment of component to PCB
Glenbrook X-Ray Station
- X-Ray inspection of BGA, µBGA, CSP or any other component
Electrovert Wave Solder
- Up to 18” board width
Component Lead Forming Equipment
- Hepco, Mark V, ADP
Westkleen Aqueous Cleaning System (with Closed loop filtration)