Double sided Surface Mount Technology (SMT), Through Hole (PTH), or Mixed Technology Assembly

RoHS (Lead-Free) Capable

Quick Turn Prototypes

Circuit Boards up to 18” x 24” and 32 layers

In-Circuit and Functional Testing

Design For Manufacturability (DFM) Assistance

Full or Partial Box Build

Customer Drop Ship


Assembleon Pick and Place

  • 18000 components per hour
  • BGA, µBGA, CSP, odd components
  • .012” fine pitch
  • 0201 components
  • Connectors up to 4” (100mm) long

Spea In-Circuit Tester

  • Analog and Digital device testing
  • AOI optical inspection

Ekra Automated Stencil Printer

  • Up to 29” x 29”
  • Vision alignment
  • Post print vision inspection

Heller Convection Reflow oven
Vitronics IR Reflow Oven

  • Seven thermal zones
  • KIC thermal profiling software

OK Industries BGA Rework Station

  • BGA, µBGA, CSP, Fine Pitch Rework
  • Computer controlled profiling software
  • Vision alignment of component to PCB

Glenbrook X-Ray Station

  • X-Ray inspection of BGA, µBGA, CSP or any other component

Electrovert Wave Solder

  • Up to 18” board width

Component Lead Forming Equipment

  • Hepco, Mark V, ADP

Westkleen Aqueous Cleaning System (with Closed loop filtration)